Packaging for high speed integrated circuits

ABSTRACT

An integrated circuit package comprises an integrated circuit die comprising a first pad, a second pad adjacent to the first pad, a third pad adjacent to the second pad, and a fourth pad adjacent to the third pad. A lead frame comprising a first lead, a second lead adjacent to the first lead, a third lead adjacent to the second lead, and a fourth lead adjacent to the third lead. First, second, third and fourth bondwires connect the first, second, third and fourth leads to the first, second, third and fourth pads, respectively. The first and second leads and the third and fourth leads are spaced at a first distance and the second and third leads are spaced at a second distance that is different than the first distance.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.11/248,985 filed on Oct. 12, 2005, and claims the benefit of U.S.Provisional Application Nos. 60/722,272, filed on Sep. 30, 2005 and60/701,701, filed on Jul. 22, 2005. The disclosures of the aboveapplications are incorporated herein by reference in its entirety.

FIELD OF THE INVENTION

The present invention relates to packaging for integrated circuits(ICs), and more particularly high speed packaging for ICs.

BACKGROUND OF THE INVENTION

Modern integrated circuits (ICs) typically employ differentialsignaling. In differential signaling, a signal is conveyed between twoseparate, active conductors instead of one active conductor and ground.The magnitude of the differential signal is the difference between thetwo signals rather than the voltages between the two individual signalsand ground.

To transmit or receive differential signals to or from an IC, thedifferential signals are transmitted over a pair of conductors of a leadframe. Referring now to FIGS. 1-2, exemplary packages 10 and 10′ areshown to include an integrated circuit die 12 having pads 14 that areconnected by bondwires 16 to leads 20 of a lead frame 24. The packages10 and 10′ are typically encased in a suitable protective material 24.

Referring now to FIG. 3, differential signal pairs 50-1, 50-2 and 50-3are connected by leads 20-1A and 20-1B, 20-2A and 20-2B, and 20-3A and20-3B and bondwires 16-1A and 16-1B, 16-2A and 16-2B, and 16-3A and16-3B, respectively, to pads 14-1A and 14-1B, 14-2A and 14-2B, and 14-3Aand 14-3B, respectively, of the integrated circuit die 12. In eachdifferential pair in FIG. 3, the notation A represents a first polarityconductor and the notation B represents a second polarity conductor,respectively.

Adjacent differential pairs are typically located in close proximity toone another. In some circumstances, the differential pairs may besituated with a first polarity conductor of one pair located immediatelyadjacent to a second polarity conductor of the same pair on one side andwith a second polarity conductor of another pair on the opposite side.Pair coupling tends to occur between adjacent high speed differentialsignals. For example, pair coupling tends to occur at 60 and 62 in FIG.3. The magnitude of the difference between the signals carried on theadjacent pairs tends to cause data errors and/or to reduce designmargins to an unacceptable level particularly for high speed signalssuch as Gigabit per second and higher data rates. The pair couplingproblem tends to be even greater for low cost plastic lead frames ascompared to ball grid array (BGA) packaging with a ground plane shield.

SUMMARY OF THE INVENTION

An integrated circuit package comprises an integrated circuit diecomprising a first pad, a second pad adjacent to the first pad, a thirdpad adjacent to the second pad, and a fourth pad adjacent to the thirdpad. A lead frame comprises a first lead, a second lead adjacent to thefirst lead, a third lead adjacent to the second lead, and a fourth leadadjacent to the third lead, wherein a first end of the fourth leadextends beyond at least one of the first, second, and third leads and ina direction towards a path defined by the third lead. First, second,third and fourth bondwires connect the first, second, fourth and thirdleads to the first, second, third and fourth pads, respectively.

In other features, the first lead carries a signal having a firstpolarity, the second lead carries a signal having a second polarity, thethird lead carries a signal having the second polarity and the fourthlead carries a signal having the first polarity, wherein the first andsecond polarities are opposite polarities. The leads of the lead framecarry high speed differential signals. The high speed signals have afrequency greater than or equal to 1 Gigabit per second (Gb/s). Thefirst, second, third and fourth leads are spaced at least a firstdistance from the integrated circuit die and the lead frame furthercomprises fifth and sixth leads that are spaced a second distance fromthe integrated circuit die, wherein the first distance is greater thanthe second distance.

In other features, fifth and sixth bondwires connect fifth and sixthleads to fifth and sixth pads. The first, second, third and fourthbondwires have a first length and the fifth and sixth bondwires have asecond length and wherein the second length is shorter than the firstlength. The fifth and sixth leads carry signals having a first speed andwherein the first, second, third and fourth leads carry signals having asecond speed that is higher than the first speed.

In other features, the integrated circuit package includes a high speedserializer/deserializer (SERDES). The first and second pads of theintegrated circuit die are associated with differential transmit signalsof the SERDES and the third and fourth pads of the integrated circuitdie are associated with differential receive signals of the SERDES.

In other features, a network interface comprises the integrated circuitpackage. The network interface is Ethernet compliant and operates atspeeds greater than 1 Gigabit per second. The first bondwire comprisesfirst and second bondwires that are stacked and connected between thefirst lead and the first pad and the fifth pad, respectively, of theintegrated circuit die. The first, second, third and fourth bondwireseach comprise first and second stacked bondwires.

A method of providing an integrated circuit package comprises creating afirst pad, a second pad adjacent to the first pad, a third pad adjacentto the second pad, and a fourth pad adjacent to the third pad on anintegrated circuit die; using a lead frame comprising a first lead, asecond lead adjacent to the first lead, a third lead adjacent to thesecond lead, and a fourth lead adjacent to the third lead; extending afirst end of the fourth lead beyond at least one of the first, second,and third leads and in a direction towards a path defined by the thirdlead; and providing first, second, third and fourth bondwires connectingthe first, second, fourth and third leads to the first, second, thirdand fourth pads, respectively.

In other features, the method comprises using the first lead to carry asignal having a first polarity, the second lead to carry a signal havinga second polarity, the third lead to carry a signal having the secondpolarity and the fourth lead to carry a signal having the firstpolarity. The first and second polarities are opposite polarities. Themethod comprises using the leads of the lead frame to carry high speeddifferential signals. The high speed signals have a frequency greaterthan or equal to 1 Gigabit per second (Gb/s).

In other features, the method comprises spacing the first, second, thirdand fourth leads at least a first distance from the integrated circuitdie; and providing fifth and sixth leads on the lead frame that arespaced a second distance from the integrated circuit die, wherein thefirst distance is greater than the second distance. The method comprisesproviding fifth and sixth leads; creating fifth and sixth pads on theintegrated circuit die; connecting the fifth and sixth leads to thefifth and sixth pads using fifth and sixth bondwires. The first, second,third and fourth bondwires have a first length and the fifth and sixthbondwires have a second length and wherein the second length is shorterthan the first length.

In still other features, the method comprises using the fifth and sixthleads to carry signals having a first speed; and using the first,second, third and fourth leads to carry signals having a second speedthat is higher than the first speed. The method comprises creating afifth pad on the integrated circuit die; using first and second stackedbondwires that are stacked and connected between the first lead and thefirst pad and the fifth pad, respectively, of the integrated circuit diefor the first bondwire. The first, second, third and fourth bondwireseach comprise first and second stacked bondwires.

An integrated circuit package comprises integrated circuit die means forperforming a function comprising first connecting means for providing afirst connection surface, second connecting means for providing a secondconnection surface adjacent to the first connecting means, thirdconnecting means for providing a third connection surface adjacent tothe second connecting means, and fourth connecting means for providing afourth connection surface adjacent to the third connecting means. Framemeans comprises first conducting means for conducting, second conductingmeans for conducting adjacent to the first conducting means, thirdconducting means for conducting adjacent to the second conducting means,and fourth conducting means for conducting adjacent to the thirdconducting means. The first end of the fourth conducting means extendsbeyond at least one of the first, second, and third conducting means andin a direction towards a path defined by the third conducting means.First, second, third and fourth wire means connect the first, second,fourth and third conducting means to the first, second, third and fourthconnecting means, respectively.

In other features, the first conducting means carries a signal having afirst polarity, the second conducting means carries a signal having asecond polarity, the third conducting means carries a signal having thesecond polarity and the fourth conducting means carries a signal havingthe first polarity. The first and second polarities are oppositepolarities. The conducting means of the frame means carries high speeddifferential signals. The high speed signals have a frequency greaterthan or equal to 1 Gigabit per second (Gb/s). The first, second, thirdand fourth conducting means are spaced at least a first distance fromthe integrated circuit die means and the frame means further comprisesfifth and sixth conducting means that are spaced a second distance fromthe integrated circuit die means. The first distance is greater than thesecond distance.

In other features, fifth and sixth wire means connect fifth and sixthconducting means to fifth and sixth connecting means, wherein the first,second, third and fourth wire means have a first length and the fifthand sixth wire means have a second length. The second length is shorterthan the first length. The fifth and sixth conducting means carrysignals having a first speed. The first, second, third and fourthconducting means carry signals having a second speed that is higher thanthe first speed.

In other features, the integrated circuit package includes high speedserializer/deserializer (SERDES) means for serializing anddeserializing. The first and second connecting means of the integratedcircuit die means are associated with differential transmit signals ofthe SERDES means and the third and fourth connecting means of theintegrated circuit die means are associated with differential receivesignals of the SERDES means.

A network interface comprises the integrated circuit package. Thenetwork interface is Ethernet compliant and operates at speeds greaterthan 1 Gigabit per second. In other features fifth connecting meansprovides a connection surface on the integrated circuit die means. Thefirst wire means comprises first and second stacked wire means forconnecting that are stacked and connected between the first conductingmeans and the first connecting means and the fifth connecting means,respectively, of the integrated circuit die means. The first, second,third and fourth wire means each comprise first and second stacked wiremeans for connecting.

A lead frame for an integrated circuit die comprises a first lead, asecond lead adjacent to the first lead, a third lead adjacent to thesecond lead, and a fourth lead adjacent to the third lead. A first endof the fourth lead extends beyond at least one of the first, second, andthird leads and in a direction towards a path defined by the third lead.

In other features, the first lead carries a signal having a firstpolarity, the second lead carries a signal having a second polarity, thethird lead carries a signal having the second polarity and the fourthlead carries a signal having the first polarity, wherein the first andsecond polarities are opposite polarities. The leads of the lead framecarry high speed differential signals. The high speed signals have afrequency greater than or equal to 1 Gigabit per second (Gb/s).

In yet other features, the first, second, third and fourth leads arespaced at least a first distance from the integrated circuit die and thelead frame further comprises fifth and sixth leads that are spaced asecond distance from the integrated circuit die. The first distance isgreater than the second distance. The fifth and sixth leads carrysignals having a first speed. The first, second, third and fourth leadscarry signals having a second speed that is higher than the first speed.The fourth lead is generally “L”-shaped.

A method for providing a lead frame for an integrated circuit diecomprising locating a second lead adjacent to a first lead; locating athird lead adjacent to the second lead; locating a fourth lead adjacentto the third lead; and extending a first end of the fourth lead beyondat least one of the first, second, and third leads and in a directiontowards a path defined by the third lead.

In other features, the method comprises using the first lead to carry asignal having a first polarity, the second lead to carry a signal havinga second polarity, the third lead to carry a signal having the secondpolarity and the fourth lead to carry a signal having the firstpolarity, wherein the first and second polarities are oppositepolarities. The first and second and third and fourth leads of the leadframe carry high speed differential signals. The high speed signals havea frequency greater than or equal to 1 Gigabit per second (Gb/s). Themethod comprises spacing the first, second, third and fourth leads atleast a first distance from the integrated circuit die; and locatingfifth and sixth leads a second distance from the integrated circuit die.The first distance is greater than the second distance.

In other features, the method comprises using the fifth and sixth leadscarry signals having a first speed; and using the first, second, thirdand fourth leads carry signals having a second speed that is higher thanthe first speed. The fourth lead is generally “L”-shaped.

A lead frame for an integrated circuit die comprising first conductingmeans for conducting, second conducting means for conducting adjacent tothe first conducting means, third conducting means for conductingadjacent to the second conducting means, and fourth conducting means forconducting adjacent to the third conducting means. A first end of thefourth conducting means extends beyond at least one of the first,second, and third conducting means and in a direction towards a pathdefined by the third conducting means.

In other feature, the first conducting means carries a signal having afirst polarity, the second conducting means carries a signal having asecond polarity, the third conducting means carries a signal having thesecond polarity and the fourth conducting means carries a signal havingthe first polarity, wherein the first and second polarities are oppositepolarities. The conducting means of the lead frame carries high speeddifferential signals. The high speed signals have a frequency greaterthan or equal to 1 Gigabit per second (Gb/s).

In other features, the first, second, third and fourth conducting meansare spaced at least a first distance from the integrated circuit die andthe lead frame further comprises fifth and sixth conducting means forconducting that are spaced a second distance from the integrated circuitdie, wherein the first distance is greater than the second distance. Thefifth and sixth conducting means carry signals having a first speed andwherein the first, second, third and fourth conducting means carrysignals having a second speed that is higher than the first speed. Thefourth conducting means is generally “L”-shaped.

An integrated circuit package comprises an integrated circuit diecomprising at least four pads that at least one of transmit and receivedifferential signals. A lead frame comprises at least four leads. Atleast four bondwires connect the leads to the pads. A set of polaritiesof adjacent signals carried by the at least four leads is different thana set of polarities of adjacent signals carried by the bondwires and thepads.

In other features, a first lead carries a signal having a firstpolarity, a second lead is adjacent to the first lead and carries asignal having a second polarity, a third lead is adjacent to the secondlead and carries a signal having the second polarity and a fourth leadis adjacent to the third lead and carries a signal having the firstpolarity. A first pad carries a signal having the first polarity, asecond pad is adjacent to the first pad and carries a signal having asecond polarity, a third pad is adjacent to the second pad and carries asignal having the first polarity and a fourth pad is adjacent to thethird pad and carries a signal having the second polarity, and whereinthe first and second polarities are opposite polarities. The leads ofthe lead frame carry high speed differential signals. The high speedsignals have a frequency greater than or equal to 1 Gigabit per second(Gb/s).

In other features, the four leads are spaced at least a first distancefrom the integrated circuit die and the lead frame further comprisesfifth and sixth leads that are spaced a second distance from theintegrated circuit die. The first distance is greater than the seconddistance. Fifth and sixth bondwires connect fifth and sixth leads tofifth and sixth pads. The first, second, third and fourth bondwires havea first length and the fifth and sixth bondwires have a second lengthand wherein the second length is shorter than the first length. Thefifth and sixth leads carry signals having a first speed and wherein thefour leads carry signals having a second speed that is higher than thefirst speed.

In other features, the integrated circuit package comprises a high speedserializer/deserializer.

In other features, a network interface comprises the integrated circuitpackage. The network interface is Ethernet compliant at speeds greaterthan 1 Gigabit per second. A fifth pad is located on the integratedcircuit die. The first bondwire comprises first and second bondwiresthat are stacked and connected between the first lead and the first padand the fifth pad, respectively, of the integrated circuit die. Thefirst, second, third and fourth bondwires each comprise first and secondstacked bondwires.

A method for providing an integrated circuit package comprises providingan integrated circuit die comprising at least four pads that at leastone of transmit and receive differential signals; connecting thetransmit and receive differential signals to the integrated circuit dieusing a lead frame comprising at least four leads; and connecting theleads to the pads using at least four bondwires, wherein a set ofpolarities of adjacent signals carried by the at least four leads isdifferent than a set of polarities of adjacent signals carried by thebondwires and the pads.

In other features, a first lead carries a signal having a firstpolarity, a second lead is adjacent to the first lead and carries asignal having a second polarity, a third lead is adjacent to the secondlead and carries a signal having the second polarity and a fourth leadis adjacent to the third lead and carries a signal having the firstpolarity. A first pad carries a signal having the first polarity, asecond pad is adjacent to the first pad and carries a signal having asecond polarity, a third pad is adjacent to the second pad and carries asignal having the first polarity and a fourth pad is adjacent to thethird pad and carries a signal having the second polarity. The first andsecond polarities are opposite polarities. The leads of the lead framecarry high speed differential signals. The high speed signals have afrequency greater than or equal to 1 Gigabit per second (Gb/s).

In other features, the method comprises spacing the four leads at leasta first distance from the integrated circuit die; and spacing fifth andsixth leads a second distance from the integrated circuit die, whereinthe first distance is greater than the second distance. The methodcomprises providing fifth and sixth leads; providing fifth and sixthpads on the integrated circuit die; connecting the fifth and sixth leadsto the fifth and sixth pads using fifth and sixth bondwires. The first,second, third and fourth bondwires have a first length and the fifth andsixth bondwires have a second length and wherein the second length isshorter than the first length. The fifth and sixth leads carry signalshaving a first speed. The four leads carry signals having a second speedthat is higher than the first speed. The method comprises providing afifth pad on the integrated circuit die. The first bondwire comprisesfirst and second bondwires that are stacked and connected between thefirst lead and the first pad and the fifth pad, respectively, of theintegrated circuit die. The method comprises using first and secondstacked bondwires for each of the first, second, third and fourthbondwires.

An integrated circuit package comprises integrated circuit die means forproviding a function comprising at least four connecting means forproviding a connection surface that at least one of transmit and receivedifferential signals, a lead frame comprising at least four conductingmeans for conducting, and at least four wire means for connecting theleads to the pads, wherein a set of polarities of adjacent signalscarried by the at least four conducting means is different than a set ofpolarities of adjacent signals carried by the wire means and theconnecting means.

In other features, a first of the four conducting means carries a signalhaving a first polarity, a second of the four conducting means isadjacent to the first of the four conducting means and carries a signalhaving a second polarity, a third of the four conducting means isadjacent to the second of the four conducting means and carries a signalhaving the second polarity and a fourth of the four conducting means isadjacent to the third of the four conducting means and carries a signalhaving the first polarity. A first of the four connecting means carriesa signal having the first polarity, a second of the four connectingmeans is adjacent to the first of the four connecting means and carriesa signal having a second polarity, a third of the four connecting meansis adjacent to the second of the four connecting means and carries asignal having the first polarity and a fourth of the four connectingmeans is adjacent to the third of the four connecting means and carriesa signal having the second polarity, and wherein the first and secondpolarities are opposite polarities. The conducting means of the leadframe carries high speed differential signals. The high speeddifferential signals have a frequency greater than or equal to 1 Gigabitper second (Gb/s). The four conducting means are spaced at least a firstdistance from the integrated circuit die and the lead frame furthercomprises fifth and sixth conducting means for conducting that arespaced a second distance from the integrated circuit die means, whereinthe first distance is greater than the second distance.

In other features, fifth and sixth wire means connects fifth and sixthconducting means to fifth and sixth connecting means. The first, second,third and fourth wire means have a first length and the fifth and sixthwire means have a second length. The second length is shorter than thefirst length. The fifth and sixth conducting means carry signals havinga first speed. The four conducting means carry signals having a secondspeed that is higher than the first speed.

In other features, the integrated circuit package includes a high speedserializer/deserializer means for serializing and deserializing signals.

In other features, a network interface comprising the integrated circuitpackage. The network interface is Ethernet compliant at speeds greaterthan 1 Gigabit per second.

In other features, fifth connecting means provides a connection surfaceon the integrated circuit die. The first wire means comprises first andsecond stacked wire means that are stacked and connected between thefirst conducting means and the first connecting means and the fifthconnecting means, respectively, of the integrated circuit die means. Thefirst, second, third and fourth wire means each comprise first andsecond stacked wire means.

In still other features, the integrated circuit package is implementedin a hard disk drive, a digital versatile disc, a set top box, a vehiclecontrol system, a cellular phone and/or a media player.

An integrated circuit package comprises an integrated circuit diecomprising N adjacent pads, where N is an integer greater than three. Alead frame comprises a first pair of leads including a first and secondlead and a second pairs of leads including third and fourth leads. Thefirst, second, third and fourth leads include first ends that are spacedfrom the integrated circuit die and second ends that are adjacent to theintegrated circuit die. The first and second pairs of leads carrydifferential signals. The third lead of the second pair of leads has afirst polarity and the fourth lead of the second pair of leads has asecond polarity. The third lead is located on one side of the fourthlead at the first end and is located on an opposite side of the fourthlead at the second end. N connections connect the second ends of thefirst and second pairs of leads to the N adjacent pads.

In other features, the N connections comprise N bondwires. The thirdlead crosses the fourth lead. The fourth lead is segmented and comprisesfirst and second segments and a bondwire connecting the first and secondsegments over the third lead. The second end of the third lead islocated between the second ends of the second lead and the fourth lead.The second end of the fourth lead is located between the second ends ofthe third lead and the second lead. The third lead comprises a firstsection, a second section and a middle section that connects the firstand second sections. The first section is co-linear with the firstsegment of the fourth lead and the second section is co-linear with thesecond segment. The first and second pairs of leads of the lead framecarry high speed differential signals. The high speed differentialsignals have a frequency greater than or equal to 1 Gigabit per second(Gb/s).

In other features, the second ends of the first and second pairs ofleads are spaced at least a first distance from the integrated circuitdie and the lead frame further comprises fifth and sixth leads that arespaced a second distance from the integrated circuit die, wherein thefirst distance is greater than the second distance. Fifth and sixthbondwires connect fifth and sixth leads to fifth and sixth pads. The Nbondwires have a first length and the fifth and sixth bondwires have asecond length that is shorter than the first length. The fifth and sixthleads carry signals having a first speed. The first and second pairs ofleads carry signals having a second speed that is higher than the firstspeed.

In other features, a serializer/deserializer (SERDES) modulecommunicates with the N pads. A network interface comprises theintegrated circuit package. The network interface is Ethernet compliantand operates at speeds greater than 1 Gigabit per second. At least oneof the N bondwires comprises first and second bondwires that are stackedand connected between one of the first and second pairs of leads and oneof the N pads of the integrated circuit die.

A method of providing an integrated circuit package comprises: providingN adjacent pads on an integrated circuit die, where N is an integergreater than three; providing a lead frame comprising a first pair ofleads including a first and second lead and a second pair of leadsincluding third and fourth leads, wherein the first, second, third andfourth leads include first ends that are spaced from the integratedcircuit die and second ends that are adjacent to the integrated circuitdie; using the first and second pairs of leads to carry differentialsignals wherein the third lead of the second pair of leads has a firstpolarity and the fourth lead of the second pair of leads has a secondpolarity; locating the third lead on one side of the fourth lead at thefirst end and on an opposite side of the fourth lead at the second end;and connecting the second ends of the first and second pairs of leads tothe N adjacent pads.

In other features, the method comprises connecting the second ends ofthe first and second pairs of leads using N bondwires. The third leadcrosses the fourth lead. The fourth lead is segmented and comprisesfirst and second segments and a bondwire connecting the first and secondsegments over the third lead. The second end of the third lead islocated between the second ends of the second lead and the fourth lead.

In other features, the second end of the fourth lead is located betweenthe second ends of the third lead and the second lead. The third leadcomprises a first section, a second section and a middle section thatconnects the first and second sections. The first section is co-linearwith the first segment of the fourth lead and the second section isco-linear with the second segment. The first and second pairs of leadsof the lead frame carry high speed differential signals. The high speeddifferential signals have a frequency greater than or equal to 1 Gigabitper second (Gb/s).

In other features, the method comprises spacing the second ends of thefirst and second pairs of leads at least a first distance from theintegrated circuit die and the lead frame further comprises fifth andsixth leads that are spaced a second distance from the integratedcircuit die, wherein the first distance is greater than the seconddistance.

In other features, the method comprises providing fifth and sixth leadsand providing fifth and sixth pads on the integrated circuit die; andusing fifth and sixth bondwires to connect the fifth and sixth leads tothe fifth and sixth pads, wherein the N bondwires have a first lengthand the fifth and sixth bondwires have a second length that is shorterthan the first length.

In other features, the method comprises using the fifth and sixth leadsto carry signals having a first speed; and using the first and secondpairs of leads to carry signals having a second speed that is higherthan the first speed. The integrated circuit die includes aserializer/deserializer (SERDES) module that communicates with the Npads. The integrated circuit die implements a network interface that isEthernet compliant and operates at speeds greater than 1 Gigabit persecond.

In other features, at least one of the N bondwires comprises first andsecond bondwires that are stacked and connected between one of the firstand second pairs of leads and one of the N pads of the integratedcircuit die.

An integrated circuit package comprises an integrated circuit diecomprising N adjacent pads, where N is an integer greater than three. Asubstrate comprises a first pair of traces including first and secondtraces and a second pair of traces including third and fourth traces.The first, second, third and fourth traces include first ends that arespaced from the integrated circuit die and second ends that are adjacentto the integrated circuit die. The first and second pairs of tracescarry differential signals. The third trace of the second pair of traceshas a first polarity and the fourth trace of the second pair of traceshas a second polarity. The third trace is located on one side of thefourth trace at the first end and is located on an opposite side of thefourth trace at the second end. N connections independently connect thesecond ends to N pads.

In other features, the N connections comprise N bondwires that connectthe second ends to the N pads. The third trace crosses the fourth trace.The fourth trace is segmented. The fourth trace comprises first andsecond segments, a first via that passes through the substrate andcommunicates with the first segment, a second via that passes throughthe substrate and communicates with the second segment, and a trace onan opposite side of the substrate that communicates with the first andsecond vias. The second end of the third trace is located between thesecond ends of the fourth trace and the second trace.

In other features, the second end of the fourth trace is located betweenthe second ends of the third trace and the second trace. The third tracecomprises a first section, a second section and a middle crossoversection that connects the first and second sections. The first sectionis co-linear with the first segment and the second section is co-linearwith the second segment. The first and second pairs of traces of thesubstrate carry high speed differential signals. The high speeddifferential signals have a frequency greater than or equal to 1 Gigabitper second (Gb/s). The second ends of the first and second pairs oftraces are spaced at least a first distance from the integrated circuitdie and the substrate further comprises fifth and sixth traces that arespaced a second distance from the integrated circuit die, wherein thefirst distance is greater than the second distance. Fifth and sixthbondwires connect fifth and sixth traces to fifth and sixth pads. The Nbondwires have a first length and the fifth and sixth bondwires have asecond length that is shorter than the first length.

In other features, the fifth and sixth traces carry signals having afirst speed and wherein the first and second pairs of traces carrysignals having a second speed that is higher than the first speed. Aserializer/deserializer (SERDES) module communicates with the N pads. Anetwork interface comprising the integrated circuit package. The networkinterface is Ethernet compliant and operates at speeds greater than 1Gigabit per second. At least one of the N bondwires comprises first andsecond bondwires that are stacked and connected between at least one ofthe first, second, third and fourth traces and at least one of the Npads of the integrated circuit die.

In other features, the substrate includes a first conductive plane. Thefourth trace comprises first and second trace segments, a first via thatpasses through the substrate to the first conductive plane andcommunicates with the first segment, a second via that passes throughthe substrate to the first conductive plane and communicates with thesecond segment, and jumper that is coplanar with and isolated from thefirst conductive plane and that communicates with the first and secondvias. The first conductive plane includes one of a ground plane, asignal plane and a power plane.

A method of providing an integrated circuit package comprises: providingN adjacent pads on an integrated circuit die, where N is an integergreater than three; providing a substrate comprising a first pair oftraces including first and second traces and a second pair of tracesincluding third and fourth traces. The first, second, third and fourthtraces include first ends that are spaced from the integrated circuitdie and second ends that are adjacent to the integrated circuit die. Thefirst and second pairs of traces carry differential signals. The thirdtrace of the second pair of traces has a first polarity and the fourthtrace of the second pair of traces has a second polarity. The thirdtrace is located on one side of the fourth trace at the first end and islocated on an opposite side of the fourth trace at the second end. Themethod comprises independently connecting the second ends to N pads.

In other features, the method comprises using N bondwires to connect thesecond ends to the N pads. The third trace crosses the fourth trace. Thefourth trace is segmented. The fourth trace comprises first and secondsegments, a first via that passes through the substrate and communicateswith the first segment, a second via that passes through the substrateand communicates with the second segment, and a trace on an oppositeside of the substrate that communicates with the first and second vias.

In other features, the second end of the third trace is located betweenthe second ends of the fourth trace and the second trace. The second endof the fourth trace is located between the second ends of the thirdtrace and the second trace. The third trace comprises a first section, asecond section and a middle crossover section that connects the firstand second sections. The first section is co-linear with the firstsegment and the second section is co-linear with the second segment. Thefirst and second pairs of traces of the substrate carry high speeddifferential signals. The high speed differential signals have afrequency greater than or equal to 1 Gigabit per second (Gb/s).

In other features, the method comprises spacing the second ends of thefirst and second pairs of traces at least a first distance from theintegrated circuit die; and providing fifth and sixth traces that arespaced a second distance from the integrated circuit die, wherein thefirst distance is greater than the second distance.

In other features, the method comprises providing fifth and sixthtraces; providing fifth and sixth pads on the integrated circuit die;using fifth and sixth bondwires connecting the fifth and sixth traces tothe fifth and sixth pads, wherein the N bondwires have a first lengthand the fifth and sixth bondwires have a second length that is shorterthan the first length.

In other features, the method comprises using the fifth and sixth tracesto carry signals having a first speed; and using the first and secondpairs of traces to carry signals having a second speed that is higherthan the first speed. The method comprises connecting aserializer/deserializer (SERDES) module to the N pads.

In other features, the method comprises implementing a network interfaceon the integrated circuit die that is Ethernet compliant and operates atspeeds greater than 1 Gigabit per second. At least one of the Nbondwires comprises first and second bondwires that are stacked andconnected between at least one of the first, second, third and fourthtraces and at least one of the N pads of the integrated circuit die. Thesubstrate includes a first conductive plane and wherein the fourth tracecomprises first and second trace segments, a first via that passesthrough the substrate to the first conductive plane and communicateswith the first segment, a second via that passes through the substrateto the first conductive plane and communicates with the second segment,and jumper that is coplanar with and isolated from the first conductiveplane and that communicates with the first and second vias. The firstconductive plane includes one of a ground plane, a signal plane and apower plane.

An integrated circuit package comprises an integrated circuit diecomprising N pads, where N is an integer greater than one. A lead framecomprises N adjacent leads. N connections individually connect the Nleads to the N pads, respectively. A first material comprising aninsulating layer and a conductive layer, wherein the insulating layer isadhesively arranged on the N leads of the lead frame.

In other features, the N connections comprise N bondwires. The firstmaterial comprises a plurality of spaced perforations. A packagingmaterial contacts the integrated circuit die, the first material, thelead frame and the N bondwires. The N leads comprise first, second,third and fourth leads. The first and second leads and the third andfourth leads are spaced at a first distance and the second and thirdleads are spaced at a second distance that is different than the firstdistance. The first and second leads and the third and fourth leads ofthe lead frame carry high speed differential signals. The high speeddifferential signals have a frequency greater than or equal to 1 Gigabitper second (Gb/s). The lead frame further comprises a fifth lead that isspaced a third distance from the fourth lead. The third distance isdifferent than the first and second distances. A sixth lead is spaced afourth distance from the fifth lead. The fourth distance is differentthan the first distance. The fifth and sixth leads carry controlsignals.

In other features, a serializer/deserializer (SERDES) modulecommunicates with the first, second, third and fourth pads. The N padsinclude first, second, third and fourth pads and wherein the first andsecond pads of the integrated circuit die are associated withdifferential transmit signals of the SERDES module and the third andfourth pads of the integrated circuit die are associated withdifferential receive signals of the SERDES module. A network interfacecomprises the integrated circuit package. The network interface isEthernet compliant and operates at speeds greater than 1 Gigabit persecond. The first distance is less than the second distance.

In other features, a fifth lead is located between the second and thirdleads and communicates with a reference potential. The first materialcomprises conductive tape.

In other features, the N adjacent leads comprise a first pair of leadscomprising first and second leads and a second pairs of leads comprisingthird and fourth leads, wherein the first, second, third and fourthleads include first ends that are spaced from the integrated circuit dieand second ends that are adjacent to the integrated circuit die. Thefirst and second pairs of leads carry differential signals. The thirdlead of the second pair of leads has a first polarity and the fourthlead of the second pair of leads has a second polarity. The third leadis located on one side of the fourth lead at the first end and islocated on an opposite side of the fourth lead at the second end.

A method for providing an integrated circuit package comprises:providing an integrated circuit die comprising N pads, where N is aninteger greater than one; providing a lead frame comprising N adjacentleads; individually connecting the N leads to the N pads, respectively;and adhesively arranging a first material comprising a conductive layerand an insulating layer on the N leads of the lead frame.

In other features, the individually connecting comprises using Nbondwires. The first material comprises a plurality of spacedperforations. The method comprises packaging the integrated circuit die,the first material, the lead frame and the N bondwires in a packagingmaterial. The N leads comprise first, second, third and fourth leads.

In other features, the method comprises spacing the first and secondleads and the third and fourth leads at a first distance; and spacingthe second and third leads at a second distance that is different thanthe first distance. The method comprises carrying high speeddifferential signals using the first and second leads and the third andfourth leads of the lead frame. The high speed differential signals havea frequency greater than or equal to 1 Gigabit per second (Gb/s). Thelead frame further comprises a fifth lead and further comprising spacingthe fifth lead a third distance from the fourth lead. The third distanceis different than the first and second distances.

In other features, the method comprises providing a sixth lead; andspacing the sixth lead a fourth distance from the fifth lead, whereinthe fourth distance is different than the first distance. The methodcomprises carrying control signals using the fifth and sixth leads. Themethod comprises coupling a serializer/deserializer (SERDES) module tothe first, second, third and fourth pads.

In other features, the N pads include first, second, third and fourthpads and the method comprises associating the first and second pads ofthe integrated circuit die with differential transmit signals of theSERDES module; and associating the third and fourth pads of theintegrated circuit die with differential receive signals of the SERDESmodule. The method comprises implementing a network interface using theintegrated circuit package. The network interface is Ethernet compliantand further comprising operating the network interface at speeds greaterthan 1 Gigabit per second.

In other features, the first distance is less than the second distance.The method comprises locating a fifth lead between the second and thirdleads and connecting said fifth lead with a reference potential. Thefirst material comprises conductive tape.

Further areas of applicability of the present invention will becomeapparent from the detailed description provided hereinafter. It shouldbe understood that the detailed description and specific examples, whileindicating the preferred embodiment of the invention, are intended forpurposes of illustration only and are not intended to limit the scope ofthe invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention will become more fully understood from thedetailed description and the accompanying drawings, wherein:

FIG. 1 is a side cross sectional view of a first exemplary package, anIC, bondwires, and leads of a lead frame according to the prior art;

FIG. 2 is a side cross sectional view of a second exemplary package, anIC, bondwires, and leads of a lead frame according to the prior art;

FIG. 3 is a partial plan view of differential signal pairs connected byleads of a lead frame and bondwires to pads of the IC according to theprior art;

FIG. 4 is a partial plan view of differential signal pairs connected byleads of a lead frame and bondwires to pads of the IC according to oneimplementation of the present invention;

FIG. 5 is a partial plan view of differential signal pairs connected byleads of a lead frame and bondwires to pads of the IC according toanother implementation of the present invention;

FIG. 6A is a partial plan view of differential signal pairs connected byleads of a lead frame and stacked bondwires to pads of the IC accordingto another implementation of the present invention;

FIG. 6B is a partial side view of differential signal pairs connected byleads of a lead frame and stacked bondwires to pads of the IC of FIG.6A;

FIG. 7 illustrates packaging for an IC including aserializer/deserializer module that receives signals on differentialtransmit and receive pairs according to the present invention;

FIG. 8 illustrates a package for a network interface IC that employs thehigh speed packaging according to the present invention;

FIG. 9A illustrates the present invention arranged in a hard disk drive;

FIG. 9B illustrates the present invention arranged in a digitalversatile disc;

FIG. 9C illustrates the present invention arranged in a high definitiontelevision;

FIG. 9D illustrates the present invention arranged in a control systemof a vehicle;

FIG. 9E illustrates the present invention arranged in a cellular phone;

FIG. 9F illustrates the present invention arranged in a set top box;

FIG. 9G illustrates the present invention arranged in a media player;

FIG. 10A illustrates a package including a lead frame having irregularlyspaced leads;

FIG. 10B illustrates a package including a lead frame having irregularlyspaced leads and a ground lead between high speed leads;

FIG. 11A illustrates a package including a lead frame having irregularlyspaced leads and conductive tape with an insulating adhesive layer thatis connected to the leads;

FIG. 11B is a cross sectional side view of the conductive tape of FIG.11A;

FIG. 11C is a partial plan view of the conductive tape of FIG. 11Ashowing perforations;

FIGS. 12A-12D illustrates various ways of connecting the leads;

FIG. 13A is a side view of packaging including a ball grid arraysubstrate;

FIG. 13B is a side view of packaging including flip chip and a ball gridarray substrate;

FIG. 13C is a cross sectional view of one exemplary BGA packaging;

FIG. 14A is a plan view illustrating a BGA jumper for high speed tracesthat are connected to the integrated circuit die;

FIG. 14B is a simplified cross sectional view illustrating a BGA jumper;

FIG. 15A is a simplified cross sectional view illustrating an alternateBGA jumper that employs a ground plane thereof;

FIG. 15B is a simplified cross sectional view illustrating an alternateBGA jumper that employs a power plane thereof; and

FIG. 15C is a plan view illustrating a power plane and the BGA jumper ofFIG. 15B.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following description of the preferred embodiment(s) is merelyexemplary in nature and is in no way intended to limit the invention,its application, or uses. For purposes of clarity, the same referencenumbers will be used in the drawings to identify similar elements.

The present invention reduces pair coupling of differential linesoperating at high speeds. Referring now to FIG. 4, differential signalpairs are connected by leads of a lead frame and bondwires to pads ofthe IC according to one implementation of the present invention. A leadframe 100 comprises one or more sets 102 of leads 104 including a firstpair of leads 104-1A and 104-2B and a second pair of leads 104-2A and104-2B (collectively leads 104). The lead 104-1A is located adjacent tothe lead 104-1B, the lead 104-1B is located adjacent to the lead 104-2A,and the lead 104-2A is located adjacent to the lead 104-2B.

The lead 104-1A carries a signal having a first polarity, the lead104-1B carries a signal having a second polarity, the lead 104-2Acarries a signal having a second polarity, and the lead 104-2B carries asignal having a first polarity, respectively. Portions 108 of the leads104 near an IC 110 are generally parallel to one another. An end 109 ofat least one of the leads 104, such as lead 104-2B, extends longer thanothers of the leads 104. The at least one of the leads 104-2A alsoextends in a direction towards an adjacent lead, such as lead 104-2A. Insome implementations, the at least one of the leads 104-2B extends intoa parallel path 110 that is defined by the adjacent lead 104-2A as shownin FIG. 4. In some implementations, at least one lead 104-2B has agenerally “L” shaped configuration.

Bondwires 114-1A, 114-1B, 114-2A and 114-2B connect the leads 104-1A,104-1B, 104-2A and 104-2B to pads 116-1A, 116-1B, 116-2B and 116-2A,respectively. Therefore, pads 116-1 A, 116-1B, 116-2A and 116-2B are nowconnected to the first polarity, the second polarity, the first polarityand the second polarity, respectively. In other words, the orientationof the bondwires 114-2A and 114-2B is flipped relative to theorientation of the leads 114-2A and 104-2B. As a result of the packagingarrangement shown in FIG. 4, coupling between pairs for example at 120and 122 is reduced due to partial cancellation. The lead frame mayinclude one or more sets of leads similar to those shown as representedby dotted lines in FIG. 4.

Referring now to FIG. 5, while coupling is reduced, couplingcancellation is not complete since the leads of the lead frame aretypically longer than the bondwires. To improve cancellation, thepackaging according to some implementations of the present inventionemploys high speed leads that are shorter than leads carrying lowerspeed signals such as but not limited to control and/or status signals.The lead frame 150 may include one or more sets of high speed leads102-1 and 102-2 and one or more sets of low speed leads 152. The highspeed leads 102-1 and 102-2 have ends 156-1 and 156-2 that are spaced atleast a distance H from the IC 110 while the low speed leads are spaceda distance L from the IC 110, where H>L. The low speed leads 152 extendlonger than the high speed leads 102-1 and 102-2. The shorter high speedleads 102-1 and 102-2 tend to improve coupling cancellation. The lowspeed leads 152 are longer and require shorter bondwires, which tends toreduce the cost of the bondwires.

Referring now to FIGS. 6A and 6B, differential signal pairs areconnected by leads of a lead frame and two or more stacked bondwires topads of the IC. A lead frame 200 comprises a set of leads 202 includinga first pair of leads 204-1A and 204-2B and a second pair of leads204-2A and 204-2B (collectively the leads 204). The lead 204-1A islocated adjacent to the lead 204-1B, the lead 204-1B is located adjacentto the lead 204-2A, and the lead 204-2A is located adjacent to the lead204-2B.

The lead 204-1A carries a signal having a first polarity, the lead204-1B carries a signal having a second polarity, the lead 204-2Acarries a signal having a second polarity, and the lead 204-2B carries asignal having a first polarity, respectively. End portions of the leads204 near an IC 210 are generally parallel to one another. At least oneof the leads 204, such as lead 204-2B, extends longer than others of theleads 204. The at least one of the leads 204 also extends in a directiontowards an adjacent lead, such as lead 202-A. In some implementations,the at least one of the leads 204 extends into a parallel path that isdefined by the adjacent lead 204 as shown in FIG. 6A. Additional. setsof high speed leads and/or low speed leads can be used

Bondwires 214-1A1 and 214-1A2, 214-1B1, 214-1B2, 214-2A1, 214-2A2 and214-2B1 and 214-2B2 (collectively bondwires 214) connect leads 204-1A,204-1B, 204-2A and 204-2B to pads 216-1A1 and 216-1A2, 216-1B1 and216-1B2, 216-2A1 and 216-2A2 and 216-2B1 and 216-2B2, respectively.Therefore, pads 216-1A1 and 216-1A2, 216-1B1 and 216-1B2, 216-2A1 and216-2A2, and 216-2B1 and 216-2B2 (collectively pads 216) are nowconnected to the first polarity, the second polarity, the first polarityand the second polarity, respectively. Ends of the bondwires 214 may beattached to the leads 204 in a spaced and/or overlapping relationship.Pads 216 may be connected together by external and/or internal viasand/or traces 230.

Benefits of the stacked bondwires 214 include increased bondwirecapacitance. Bondwire coupling between stacked bondwires 214 isincreased. Bondwire capacitance per unit length is closer to lead framecapacitance per unit length. The stacked bondwires 214 also have lowerinductance per bondwire unit length. There is also a net lowertransmission line impedance of the pair of signal pins between positiveand negative pins. There is also improved coupling cancellation due toimproved matched characteristics of stacked bondwires to the lead frame.

Referring now to FIG. 7, an integrated circuit die 300 includes aserializer/deserializer (SERDES) module 301 that receives signals ondifferential transmit and receive pairs according to the presentinvention. In some implementations, high speed differential pairs of theSERDES module 301 operate at speeds greater than or equal to 1 Gb/s.

Referring now to FIG. 8, a network interface IC 350 includesdifferential pairs that employ the high speed packaging according to thepresent invention. In some implementations, high speed differentialpairs of the network interface operate at speeds greater than or equalto 1 Gb/s. In some implementations, high speed differential pairs of thenetwork interface operate at speeds greater than or equal to 10 Gb/s. Insome implementations, the network interface comprises a physical layerdevice (PHY). In other implementations, the network interface comprisesa medium access controller (MAC). In still other implementations, thenetwork interface is compliant with 1 Gb/s and 10 Gb/s Ethernetprotocols.

Referring now to FIGS. 9A-9G, various exemplary implementations of thepresent invention are shown. Referring now to FIG. 9A, the presentinvention can be implemented in a hard disk drive 400. The presentinvention may implement either or both signal processing and/or controlcircuits, which are generally identified in FIG. 9A at 402. In someimplementations, the signal processing and/or control circuit 402 and/orother circuits (not shown) in the HDD 400 may process data, performcoding and/or encryption, perform calculations, and/or format data thatis output to and/or received from a magnetic storage medium 406.

The HDD 400 may communicate with a host device (not shown) such as acomputer, mobile computing devices such as personal digital assistants,cellular phones, media or MP3 players and the like, and/or other devicesvia one or more wired or wireless communication links 408. The HDD 400may be connected to memory 409 such as random access memory (RAM), lowlatency nonvolatile memory such as flash memory, read only memory (ROM)and/or other suitable electronic data storage.

Referring now to FIG. 9B, the present invention can be implemented in adigital versatile disc (DVD) drive 410. The present invention mayimplement either or both signal processing and/or control circuits,which are generally identified in FIG. 9B at 412, and/or mass datastorage of the DVD drive 410. The signal processing and/or controlcircuit 412 and/or other circuits (not shown) in the DVD 410 may processdata, perform coding and/or encryption, perform calculations, and/orformat data that is read from and/or data written to an optical storagemedium 416. In some implementations, the signal processing and/orcontrol circuit 412 and/or other circuits (not shown) in the DVD 410 canalso perform other functions such as encoding and/or decoding and/or anyother signal processing functions associated with a DVD drive.

The DVD drive 410 may communicate with an output device (not shown) suchas a computer, television or other device via one or more wired orwireless communication links 417. The DVD 410 may communicate with massdata storage 418 that stores data in a nonvolatile manner. The mass datastorage 418 may include a hard disk drive (HDD). The HDD may have theconfiguration shown in FIG. 9A. The HDD may be a mini HDD that includesone or more platters having a diameter that is smaller thanapproximately 1.8″. The DVD 410 may be connected to memory 419 such asRAM, ROM, low latency nonvolatile memory such as flash memory and/orother suitable electronic data storage.

Referring now to FIG. 9C, the present invention can be implemented in ahigh definition television (HDTV) 420. The present invention mayimplement either or both signal processing and/or control circuits,which are generally identified in FIG. 9E at 422, a WLAN interfaceand/or mass data storage of the HDTV 420. The HDTV 420 receives HDTVinput signals in either a wired or wireless format and generates HDTVoutput signals for a display 426. In some implementations, signalprocessing circuit and/or control circuit 422 and/or other circuits (notshown) of the HDTV 420 may process data, perform coding and/orencryption, perform calculations, format data and/or perform any othertype of HDTV processing that may be required.

The HDTV 420 may communicate with mass data storage 427 that stores datain a nonvolatile manner such as optical and/or magnetic storage devices.At least one HDD may have the configuration shown in FIG. 9A and/or atleast one DVD may have the configuration shown in FIG. 9B. The HDD maybe a mini HDD that includes one or more platters having a diameter thatis smaller than approximately 1.8″. The HDTV 420 may be connected tomemory 428 such as RAM, ROM, low latency nonvolatile memory such asflash memory and/or other suitable electronic data storage. The HDTV 420also may support connections with a WLAN via a WLAN network interface429.

Referring now to FIG. 9D, the present invention implements a controlsystem of a vehicle 430, a WLAN interface and/or mass data storage ofthe vehicle control system. In some implementations, the presentinvention implement a powertrain control system 432 that receives inputsfrom one or more sensors such as temperature sensors, pressure sensors,rotational sensors, airflow sensors and/or any other suitable sensorsand/or that generates one or more output control signals such as engineoperating parameters, transmission operating parameters, and/or othercontrol signals.

The present invention may also be implemented in other control systems440 of the vehicle 430. The control system 440 may likewise receivesignals from input sensors 442 and/or output control signals to one ormore output devices 444. In some implementations, the control system 440may be part of an anti-lock braking system (ABS), a navigation system, atelematics system, a vehicle telematics system, a lane departure system,an adaptive cruise control system, a vehicle entertainment system suchas a stereo, DVD, compact disc and the like. Still other implementationsare contemplated.

The powertrain control system 432 may communicate with mass data storage446 that stores data in a nonvolatile manner. The mass data storage 446may include optical and/or magnetic storage devices for example harddisk drives HDD and/or DVDs. At least one HDD may have the configurationshown in FIG. 9A and/or at least one DVD may have the configurationshown in FIG. 9B. The HDD may be a mini HDD that includes one or moreplatters having a diameter that is smaller than approximately 1.8″. Thepowertrain control system 432 may be connected to memory 447 such asRAM, ROM, low latency nonvolatile memory such as flash memory and/orother suitable electronic data storage. The powertrain control system432 also may support connections with a WLAN via a WLAN networkinterface 448. The control system 440 may also include mass datastorage, memory and/or a WLAN interface (all not shown).

Referring now to FIG. 9E, the present invention can be implemented in acellular phone 450 that may include a cellular antenna 451. The presentinvention may implement either or both signal processing and/or controlcircuits, which are generally identified in FIG. 9E at 452, a WLANinterface and/or mass data storage of the cellular phone 450. In someimplementations, the cellular phone 450 includes a microphone 456, anaudio output 458 such as a speaker and/or audio output jack, a display460 and/or an input device 462 such as a keypad, pointing device, voiceactuation and/or other input device. The signal processing and/orcontrol circuits 452 and/or other circuits (not shown) in the cellularphone 450 may process data, perform coding and/or encryption, performcalculations, format data and/or perform other cellular phone functions.

The cellular phone 450 may communicate with mass data storage 464 thatstores data in a nonvolatile manner such as optical and/or magneticstorage devices for example hard disk drives HDD and/or DVDs. At leastone HDD may have the configuration shown in FIG. 9A and/or at least oneDVD may have the configuration shown in FIG. 9B. The HDD may be a miniHDD that includes one or more platters having a diameter that is smallerthan approximately 1.8″. The cellular phone 450 may be connected tomemory 466 such as RAM, ROM, low latency nonvolatile memory such asflash memory and/or other suitable electronic data storage. The cellularphone 450 also may support connections with a WLAN via a WLAN networkinterface 468.

Referring now to FIG. 9F, the present invention can be implemented in aset top box 480. The present invention may implement either or bothsignal processing and/or control circuits, which are generallyidentified in FIG. 9F at 484, a WLAN interface and/or mass data storageof the set top box 480. The set top box 480 receives signals from asource such as a broadband source and outputs standard and/or highdefinition audio/video signals suitable for a display 488 such as atelevision and/or monitor and/or other video and/or audio outputdevices. The signal processing and/or control circuits 484 and/or othercircuits (not shown) of the set top box 480 may process data, performcoding and/or encryption, perform calculations, format data and/orperform any other set top box function.

The set top box 480 may communicate with mass data storage 490 thatstores data in a nonvolatile manner. The mass data storage 490 mayinclude optical and/or magnetic storage devices for example hard diskdrives HDD and/or DVDs. At least one HDD may have the configurationshown in FIG. 9A and/or at least one DVD may have the configurationshown in FIG. 9B. The HDD may be a mini HDD that includes one or moreplatters having a diameter that is smaller than approximately 1.8″. Theset top box 480 may be connected to memory 494 such as RAM, ROM, lowlatency nonvolatile memory such as flash memory and/or other suitableelectronic data storage. The set top box 480 also may supportconnections with a WLAN via a WLAN network interface 496.

Referring now to FIG. 9F, the present invention can be implemented in amedia player 500. The present invention may implement either or bothsignal processing and/or control circuits, which are generallyidentified in FIG. 9G at 504, a WLAN interface and/or mass data storageof the media player 500. In some implementations, the media player 500includes a display 507 and/or a user input 508 such as a keypad,touchpad and the like. In some implementations, the media player 500 mayemploy a graphical user interface (GUI) that typically employs menus,drop down menus, icons and/or a point-and-click interface via thedisplay 507 and/or user input 508. The media player 500 further includesan audio output 509 such as a speaker and/or audio output jack. Thesignal processing and/or control circuits 504 and/or other circuits (notshown) of the media player 500 may process data, perform coding and/orencryption, perform calculations, format data and/or perform any othermedia player function.

The media player 500 may communicate with mass data storage 510 thatstores data such as compressed audio and/or video content in anonvolatile manner. In some implementations, the compressed audio filesinclude files that are compliant with MP3 format or other suitablecompressed audio and/or video formats. The mass data storage may includeoptical and/or magnetic storage devices for example hard disk drives HDDand/or DVDs. At least one HDD may have the configuration shown in FIG.9A and/or at least one DVD may have the configuration shown in FIG. 9B.The HDD may be a mini HDD that includes one or more platters having adiameter that is smaller than approximately 1.8″. The media player 500may be connected to memory 514 such as RAM, ROM, low latency nonvolatilememory such as flash memory and/or other suitable electronic datastorage. The media player 500 also may support connections with a WLANvia a WLAN network interface 516. Still other implementations inaddition to those described above are contemplated.

Referring now to FIG. 10A, a package including an integrated circuit die611 and a lead frame 612 having irregularly spaced leads is shown. Thelead frame 612 comprises one or more sets of leads including leads620-1, 620-2, 620-3 and 620-4, and a first pair of leads 620-5A and620-5B and a second pair of leads 620-6A and 620-6B (collectively leads620).

Bondwires 616-1, 616-2, 616-3, 616-4, 616-5A and 616-5B, and 616-6A and616-6B connect the leads 620-1, 620-2, 620-3, 620-4, 620-5 and 620-5B,and 620-6A and 620-6B to pads 614-1, 614-2, 614-3, 614-4, 614-5 and614-6 and 614-6A and 614-6B, respectively.

The leads 620-1, 620-2, 620-3 and 620-4 may be control leads thatoperate at a speed that is lower than the leads 620-5A and 620-5B and620-6A and 620-6B that operate at high speed leads. The leads 620-5A and620-5B and 620-6A and 620-6B may carry differential signals. Spacingbetween the low speed leads may be equal to d₁. Spacing between leads ina pair of high speed leads may be equal to d₄. Spacing between the lowand high speed leads may be d₂. Spacing between the pairs of high speedleads may be d₃. The spacing d₁, d₂, d₃ and d₄ may be irregular toincrease or decrease coupling. For example, the spacing d₄ may be lessthan the spacing d₃. The spacing d₄ may be less than the spacing d₁.

Referring now to FIG. 10B, a package including a lead frame havingirregularly spaced leads and a ground lead is shown. A lead 640 islocated between pairs of high speed leads and may be connected to areference potential such as ground to reduce coupling. The lead 640 mayor may not be connected to the integrated circuit die. As can beappreciated, the lead frame in FIGS. 10A and 10B may incorporatecrossovers as well as other features described above.

Referring now to FIGS. 11A-11C, a package for the integrated circuit die611 includes the lead frame 612. Conductive tape 650 is applied to atleast one side of the leads 620 of the lead frame 612. For example, theconductive tape may be connected to a top side of the leads, a bottomside of the leads, or both the top and bottom sides of the leads. Theconductive tape may also be applied to some leads but not other leads.The conductive tape 650 includes with an inner insulating adhesive layer654 and an outer conducting layer 656. The insulting layer 654 preventsshorting the leads. The insulating adhesive layer 654 is connected tothe leads 620. In FIG. 11C, the conductive tape 650 may include spacedperforations to allow the packaging material to flow through theperforations during manufacturing, which increases strength. Theconductive layer 656 provides a ground plane that conducts magneticflux, which reduces coupling.

Referring now to FIGS. 12A-12D, various crossover configurations areshown. In FIGS. 12A and 12B, a crossover 730 includes a first lead 732-Athat includes a first section 732-A1 and a second section 732-A2 thatare connected by a bondwire 734. A second lead 732-B includes a firstsection 732-B1, a center section 732-B2 and a second section 732-B3. Thefirst section 732-B1 is co-linear with the second section 732-A2. Thesecond section 732-B3 is co-linear with the first section 732-A1. Thecenter section 732-B2 is diagonal relative to the first and secondsections 732-B1 and 732-B3. The center section 732-B2 may also becurved.

In FIG. 12C, a crossover 750 includes a first lead 752-A that includes afirst section 752-A1 and a second section 752-A2 that are connected by abondwire 754. A second lead 752-B has a first section 752-B1, a centersection 752-B2 and a second 752-B3. The first section 752-B1 isco-linear with the second section 752-A2. The second section 752-B3 isco-linear with the first section 752-A1. The center section 752-B2perpendicular to the first and second straight sections 752-B1 and752-B3. The center section may also have other suitable shapes.

In FIG. 12D, a pair of leads 760 includes first and second leads 762 and764 that both have first (labeled -1), center (labeled -2) and second(labeled -3) sections. The center section of at least one lead is curvedin a direction perpendicular to a plane containing the leads to provideclearance for the other lead that passes under or over. The centersection 764-2 curves upwardly and back downwardly to provide clearancefor the center section 762-2 which is planar. Still other variations arecontemplated for the crossover.

Referring now to FIGS. 13A and 13B, various packaging techniques areshown. In FIG. 13A, a side view of integrated circuit packaging 800including a ball grid array substrate is shown. The packaging 800includes an integrated circuit die 801. Packaging material can be usedto protect one or more components of the package 800. An interconnection802 such as bondwires, flip chips, and/or Tape Automated Bonding (TAB)may be used to connect the integrated circuit die 801 to a ball gridarray substrate 804. Solder bumps 806 on the ball grid array substrate804 are aligned with mounting pads 810 of a printed circuit board 812 orother substrate or mounting surface. In FIG. 13B, integrated circuitpackaging 815 includes a flip chip or integrated circuit die 816 that isattached to the substrate 804. The substrate 804 may include mountingpads 818 that align with solder balls 817 of the flip chip 816.

Referring now to FIG. 13C, a more detailed cross sectional view of oneexemplary BGA packaging approach 830 is shown. A ball grid arraysubstrate 834 includes a copper patterned layer 835, which definestraces, vias and mounting pads on one or both sides of a substrate core840. Bondwires 854 may be used to connect one or more traces or mountingpads 849 to a mounting pad 850 on the integrated circuit die 848. Vias836 provide a connection to the opposite side of the BGA substrate 834.Mounting pads 853 on a bottom surface of the BGA substrate are definedby the copper patterned layer and receive solder bumps 844. A soldermask 855 may be applied to the copper layers 836. A crossover or jumperis integrated with the BGA substrate according to the present inventionas will be described below.

Referring now to FIG. 14A, a plan view illustrating a BGA jumper 870 forhigh speed traces 874, 876 and 878 is shown. The trace 874 comprises afirst section 874-1, a second section 874-2 and a third section 874-3(collectively trace 874). The traces 876 and 878 are connected by vias880 and 882 to an opposite side of the BGA substrate 834. A crossovertrace 883 on an opposite surface of the BGA substrate 834 connects thevias 880 and 882. The crossover trace 883 may be created by adding abuildup layer on a bottom surface of the BGA substrate. As can beappreciated, the crossover traces may have other shapes and/orconfigurations as described above.

Referring now to FIG. 14B, a simplified cross sectional viewillustrating the BGA jumper 870 is shown. The vias 880 and 882 arecollectively identified at 910. The vias 910 provide a connectionbetween traces 876 and 878 (collectively identified at 904) and thetrace or jumper 883.

Referring now to FIGS. 15A-15C, a simplified cross sectional viewillustrating an alternate BGA substrate 930 is shown. Crossover tracessuch as those shown in FIG. 14A are formed in an interconnect and traceplane 934. In FIG. 15A, the BGA substrate 930 includes I&TP 934, a powerplane 938 and a ground plane 942. A substrate core material 946 and/orother insulating layers may be located between the I&TP 934, the powerplane 938 and the ground plane 942. In FIG. 15A, vias 950 provide aconnection to a crossover jumper or trace 954 that is coplanar with butisolated from the ground plane layer 942. The trace 954 is isolated fromthe remaining portions of ground plane layer 942. As can be appreciated,the structure shown and described in FIG. 15A eliminates the need forthe buildup layer or trace 883 in FIG. 14A.

In FIG. 15B, vias 960 provide a connection to a crossover jumper ortrace 964 that is coplanar with but isolated from the power plane layer938. The trace 964 is isolated from the remaining portions of powerplane layer 938. In FIG. 15C, the jumper or trace 964 is shown in thepower plane 938. Substrate core material or other insulating materialmay be used at 970 to insulate the jumper or trace 964 from the powerplane 938. Vias 960-1 and 960-2 connect to the jumper or trace 964.

Any of the embodiments shown above may be encased by a protectivematerial as shown FIGS. 1 and 2. Those skilled in the art can nowappreciate from the foregoing description that the broad teachings ofthe present invention can be implemented in a variety of forms.Therefore, while this invention has been described in connection withparticular examples thereof, the true scope of the invention should notbe so limited since other modifications will become apparent to theskilled practitioner upon a study of the drawings, the specification andthe following claims.

1. An integrated circuit package comprising: an integrated circuit diecomprising a first pad, a second pad adjacent to said first pad, a thirdpad adjacent to said second pad, and a fourth pad adjacent to said thirdpad; a lead frame comprising a first lead, a second lead adjacent tosaid first lead, a third lead adjacent to said second lead, and a fourthlead adjacent to said third lead; and first, second, third and fourthbondwires connecting said first, second, third and fourth leads to saidfirst, second, third and fourth pads, respectively, wherein said firstand second leads and said third and fourth leads are spaced at a firstdistance and said second and third leads are spaced at a second distancethat is different than said first distance.
 2. The integrated circuitpackage of claim 1 wherein said first lead carries a signal having afirst polarity, said second lead carries a signal having a secondpolarity, said third lead carries a signal having said first polarityand said fourth lead carries a signal having said second polarity andwherein said first and second polarities are opposite polarities.
 3. Theintegrated circuit package of claim 1 wherein said first and secondleads and said third and fourth leads of said lead frame carry highspeed differential signals.
 4. The integrated circuit package of claim 3wherein said high speed differential signals have a frequency greaterthan or equal to 1 Gigabit per second (Gb/s).
 5. The integrated circuitpackage of claim 1 wherein said lead frame further comprises a fifthlead that is spaced a third distance from said fourth lead.
 6. Theintegrated circuit package of claim 5 wherein said third distance isdifferent than said first and second distances.
 7. The integratedcircuit package of claim 5 further comprising a sixth lead that isspaced a fourth distance from said fifth lead, wherein said fourthdistance is different than said first distance.
 8. The integratedcircuit package of claim 7 wherein said fifth and sixth leads carrycontrol signals.
 9. The integrated circuit package of claim 1 furthercomprising a serializer/deserializer (SERDES) module that communicateswith said first, second, third and fourth pads.
 10. The integratedcircuit package of claim 9 wherein said first and second pads of saidintegrated circuit die are associated with differential transmit signalsof said SERDES module and said third and fourth pads of said integratedcircuit die are associated with differential receive signals of saidSERDES module.
 11. A network interface comprising the integrated circuitpackage of claim
 1. 12. The network interface of claim 11 wherein saidnetwork interface is Ethernet compliant and operates at speeds greaterthan 1 Gigabit per second.
 13. The integrated circuit package of claim 1wherein said first distance is less than said second distance.
 14. Theintegrated circuit package of claim 1 further comprising a fifth leadthat is located between said second and third leads and thatcommunicates with a reference potential but does not communicate withsaid integrated circuit die.
 15. The integrated circuit package of claim1 further comprising conductive tape attached to said first, second,third and fourth leads of said lead frame.
 16. The integrated circuitpackage of claim 15 wherein said conductive tape comprises a conductivelayer and an insulating adhesive layer that contacts said first, second,third and fourth leads.
 17. The integrated circuit package of claim 16wherein said conductive tape comprises a plurality of spacedperforations.
 18. The integrated circuit package of claim 17 furthercomprising packaging material that contacts said integrated circuit die,said conductive tape, said lead frame and said bondwires.